Insulating boards are a general term for organic macromolecular compounds containing two or more epoxy groups, with the exception of a few, their relative molecular masses are not high. The molecular structure of epoxy resins is characterized by the presence of active epoxy groups within the molecular chains, which can be located at the ends, in the middle, or form a ring structure. Due to the presence of active epoxy groups in their molecular structure, they can undergo cross-linking reactions with a variety of hardeners to form insoluble, non-meltable high polymers with a three-dimensional network structure. They have strong adhesion. The inherent polar hydroxyl groups and ether bonds in the epoxy resin molecular chains contribute to their high adhesion to various substances. Epoxy resins have low shrinkage during curing, resulting in minimal internal stress, which also helps to enhance adhesion strength.