Huizhou Lianming New Materials Co., Ltd. Product Introduction: Insulating boards refer to organic macromolecular compounds containing two or more epoxy groups. Their relative molecular masses are not high, except for a few exceptions. The molecular structure of epoxy resins is characterized by the presence of active epoxy groups within the molecular chains, which can be located at the ends, in the middle, or form a ring structure. Due to the presence of active epoxy groups in their molecular structure, they can undergo cross-linking reactions with various hardeners to form insoluble, non-meltable high polymers with a three-dimensional network structure. They have strong adhesion. The presence of inherent polar hydroxyl groups and ether bonds in the epoxy resin molecular chains gives it high adhesion to various substances. The low shrinkage during curing of epoxy resins and the small internal stresses produced also contribute to increased adhesion strength. Application Characteristics: 1. Diverse forms. Various resin, hardener, and modifier systems can almost meet the requirements of various applications, ranging from extremely low viscosity to high melting point solids. 2. Easy curing. With various types of hardeners, the epoxy resin system can be cured within a temperature range of 0～180℃. 3. Strong adhesion. The presence of inherent polar hydroxyl groups and ether bonds in the epoxy resin molecular chains gives it high adhesion to various substances. The low shrinkage during curing of epoxy resins and the small internal stresses produced also help to increase adhesion strength. 4. Low shrinkage. The reaction between epoxy resins and the hardeners used is carried out through direct addition reactions or the ring-opening polymerization of epoxy groups in the resin molecules, without the release of water or other volatile by-products. Compared to unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing. 5. Insulating boards are composed of GF (special yarn), UP (unsaturated resin), low-shrinkage additives, MD (filler), and various auxiliary agents. They possess electrical insulation properties, mechanical properties, thermal stability, and resistance to chemical corrosion, with a wide range of applications, mainly in the automotive industry, railway vehicles, electrical and communication engineering, bathroom fixtures, flooring materials, explosion-proof electrical equipment enclosures, and wireless communication fields. Mechanical properties. The cured epoxy resin system exhibits excellent mechanical properties. Limited Company, manufacturer's direct sales of epoxy boards, insulating boards, lithium battery insulating boards, lithium battery separators, dustproof and waterproof. Custom orders available based on provided images.