1. Epoxy board, made by bonding glass fiber cloth with epoxy resin through heat and pressure processing, exhibits high mechanical properties at moderate temperatures and stable electrical properties in high humidity conditions. 2. Suitable for high-insulation structural parts for mechanical, electrical, and electronic applications, it boasts excellent mechanical and dielectric properties, as well as good heat and moisture resistance. Heat resistance grade: F (155°C), available in thicknesses of 0.3 to 100mm.