Direct Electroplated Metalized Substrate (DPC)
DPC (Direct plating copper) is a basic electronic material that achieves metallization of ceramic surfaces through magnetic sputter coating, based on electroplating technology, for thermoelectric separation.
Advantages
1. Higher thermal conductivity, a more compatible coefficient of thermal expansion.
2. Stronger, lower resistance metal film coating.
3. Excellent weldability and high operating temperature.
4. Good insulation properties.
5. Customizable conductive layer thickness within 0.1mm to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, and boasts a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of the equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
Product Images
Copper-clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material manufactured by bonding copper foil directly onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched into various patterns, just like PCB boards (or IMS substrates).
6. Non-polluting and free of hazards.
7. Wide operating temperature range of -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Fields: The applications of DBC ceramic substrates are extensive in the downstream market. They are used in semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are featured in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
Product Images
Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in solder (such as Ti/Ag/Zr/Cu) to bond ceramics to metals, forming a reaction layer of ceramics that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between ceramics and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability, making them suitable for connectors or applications requiring high current carrying capacity and high thermal dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
The possibility of a sealed packaging with 0% water absorption rate.
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Sports Vehicles, Aerospace, and more.
