Direct Electroplating Metalized Substrate (DPC)
DPC (Direct plating copper) is a foundational electronic material, achieved by magnetron sputter coating and based on electroplating technology, which metalizes ceramic surfaces and enables thermoelectric separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger, lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Excellent insulation properties.
5. Customizable conductive layer thickness within the range of lum to 1mm.
6. Free of organic content, resistant to cosmic rays, highly reliable in aerospace applications, with a long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Control, Telecommunications, LED Packaging, Gesture Recognition, Facial Recognition, TEC Refrigeration, MEMS Packaging, RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LEDs, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Cameras, Vehicle LED, UV LED
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly fusing copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulation properties.
3. Strong adhesion, corrosion-resistant.
4. Excellent thermal cycle performance with up to 50,000 cycles, high reliability.
5. Structures that can be etched into various patterns, like PCB boards (or IMS substrates).
6. Non-polluting and non-harmful.
7. Wide operating temperature range of -55℃ to 850℃; coefficient of thermal expansion similar to silicon, simplifying the production process of power modules.
Application Fields: The downstream applications of DBC ceramic substrates are extensive, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are present in various industrial electronic fields, including switch power supplies, solid-state relays, automotive electronics, solar panel components, telecommunication-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that achieves ceramic-to-metal bonding by utilizing the reactive metal elements in the solder (such as Ti/Ag/Zr/Cu). It forms a reactive layer in the ceramic that can be wetted by the molten solder. Compared to traditional products, AMB ceramic substrates bond through a chemical reaction between the ceramic and reactive metal paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications with high current carrying capacity and stringent heat dissipation requirements.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve up to 800 micrometers of copper weight on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Motorcycles, Aerospace, and more.
