This series of products is produced using the patented formulas of Japan's FUJIMI Company and the USA's Dupont (DUPON), suitable for semiconductor materials such as silicon wafers, germanium single crystal wafers, gallium arsenide wafers, hard disk glass, sapphire wafers, and silicon carbide wafers. They are designed for (CMP) chemical surface polishing processes, featuring high removal rates, ease of use, and excellent polishing results. After polishing, the surface roughness of the wafers can reach below 0.2um, and they also enhance the roughness and parallelism of the wafers without any scratches or polishing fog. Our company provides high-quality products to customers while reducing processing costs, making this series an excellent choice for replacing imported products.
Appearance: This product is a milky colloidal aqueous solution, non-toxic and odorless.
Features
High removal rate: Reduces the time required for polishing processes, enhancing production efficiency, allows for reuse, and has a high dilution ratio.
2: Easy to Use: This polishing liquid is suitable for general polishing processes.
3: Excellent polishing effect: The polished surface has good roughness and no scratches, no polishing fog will appear.
Application Scope and Parameters
This series of products is used for polishing single crystal silicon wafers with diameters φ76-150mm, including as-cut, zone-melted wafers and doped silicon wafers, both single-sided and double-sided. It is also applied in polishing processes for other semiconductor materials such as sapphire, germanium, and gallium arsenide wafers. Additionally, it is suitable for polishing optical crystal materials like lithium niobate.