Automotive-grade sintered silver

Features:
Exhibits superior conductivity, thermal conductivity, high adhesive strength, and stability. The nano-silver sintering process forms reliable mechanical and electrical connections in the sintered layer of chips, reducing both thermal resistance and internal resistance in semiconductor modules, thereby enhancing the module's performance and reliability. The sintering material is pure silver, lead-free, and belongs to environmentally friendly materials.

Application Fields

Automobiles, Intelligent vehicles

Product Information & Features

With the electrification of cars, the practicality of EVs and HEVs, and the introduction of SiC/GaN devices, automotive power semiconductors are heading towards diversification. For instance, not only are individual power MOSFETs available, but also IPDs (Intelligent Power Devices) that integrate control ICs (circuits) have emerged and are continually expanding in variety. The diversified automotive power semiconductors, especially as the energy consumption of EVs and HEVs using automotive power semiconductors increases, require packaging to achieve:

Low resistance,

(2) High heat dissipation,

(3) High-density packaging.
The solution to this problem lies in the key technology of automotive-grade sintered silver.