High thermal conductivity and high reliability conductive adhesive
High thermal conductivity and reliability conductive adhesive is a glue that enables low-temperature, pressure-free interconnection. It cures at a low temperature down to 200 ℃, featuring high-temperature service, excellent thermal conductivity, no residue after welding, and no cleaning required.
Application Fields
Power Amplifier (PA) Amplifier
High-power LED
Laser Pump Source
Optoelectronic Packaging
Product Information & Features
· High thermal and electrical conductivity ·Superior interface reliability
·High-temperature service characteristics ·Low-temperature curing process
·Superior workability in craftsmanship ·Lead-free, halogen-free, and solder paste-free for no-clean applications






















