High thermal conductivity and high reliability conductive adhesive

High thermal conductivity and reliability conductive adhesive is a glue that enables low-temperature, pressure-free interconnection. It cures at a low temperature down to 200 ℃, featuring high-temperature service, excellent thermal conductivity, no residue after welding, and no cleaning required.

Application Fields

Power Amplifier (PA) Amplifier

High-power LED

Laser Pump Source

Optoelectronic Packaging

Product Information & Features

· High thermal and electrical conductivity                  ·Superior interface reliability

·High-temperature service characteristics        ·Low-temperature curing process

·Superior workability in craftsmanship    ·Lead-free, halogen-free, and solder paste-free for no-clean applications