Nano-soldering bonding material

Nano-copper composite solder is a material that allows for low-temperature, low-pressure interconnections, with welding temperatures as low as 170°C, suitable for large-scale system-level module soldering, offering excellent mechanical strength and reliability.

Application Fields

Single Tube Package Power

Power module level packaging

Large-area IC heat sink packaging

Product Information & Features

High reliability                            ·Superior interface reliability

·High-temperature service characteristics     ·Low-temperature welding process

  ·Superior process operability  ·Removable adhesive tapeDry Glue