Integrated CircuitIntegrated Circuit, abbreviated as IC; or referred to asMicrocircuit（microcircuit）、Microchip（microchip）、Chip/chipElectronicsThere is a type of...CircuitPrimarily includesSemiconductorEquipment, including miniaturized components, and often manufactured in semiconductorWaferSurface-level

Packaging Concept:

Narrowly defined: A process that employs membrane technology and microfabrication techniques to arrange, affix, and connect chips and other components on a frame or substrate, lead out terminal pins, and then encapsulate and secure them using a pliable insulating medium, forming an integrated three-dimensional structure.

Broadly: The engineering process of connecting and securing the encapsulation to the substrate, assembling it into a complete system or electronic device, and ensuring the overall performance of the entire system.

Functionalities of Chip Packaging:

1. Transfer function; 2. Transfer circuit signals; 3. Provide heat dissipation paths; 4. Structural protection and support.

Technical levels of packaging engineering:

The encapsulation process begins after the integrated circuit chip is manufactured, encompassing the chip's attachment and fixation, interconnection, encapsulation, sealing protection, connection to the circuit board, system assembly, and all processes up to the completion of the final product.