Equipment Features

High versatility, applicable fields: semiconductor wire bonding, lighting LED, mini LED, Micro LED, SIP, COB, power devices, optical modules, etc.

Provide Mapping data, standard SPC software

QR code intelligent recognition, compatible with MES system integration

User-friendly GUI interface, easy to master after brief training

High precision, high efficiency, and high repeatability; detection accuracy of 1um; UPH up to 150k

Central server control system, capable of remotely controlling program editing and debugging on multiple machines

High precision and large depth of field are required for wire bonding inspection. Ji Yang Vision's independently developed layered scanning, image fusion technology, and CUDA-based GPU computing technology offer an excellent solution.

Product Specifications