Product Features
1. Integrated with an automatic soldering production line, featuring real-time monitoring of solder quality.
2. Detects solder joint quality after SMT reflow oven and wave soldering.
Functional Parameters
| Inspected circuit board | Soldering machine inspection, post-SMT reflow oven, post-wave soldering machine, etc. for焊点 |
| Resolution/Vision Range/Speed | 30um/Pixel FOV: 75*60mm, Detection Speed <330ms/FOV 25um/Pixel FOV: 62*50mm, Detection Speed <300ms/FOV 20um/Pixel FOV: 50*40mm, Detection Speed <270ms/FOV 15um/Pixel FOV: 37*30mm Detection Speed: <240ms/FOV Note: The above specifications are based on the factory standard; they can be set at the factory according to customer requirements. |
| Inspection Method | Feature extraction, full-page matching, OCV, OCR, and various advanced algorithms |
| Test Coverage Type | Offset, Solder Short, Short Circuit, Contamination, Missing Parts, Misalignment, Set Up a Monument, Side Stand Reversed parts, defective parts, damaged, floating, polarity, cold solder joints, open solder joints, excess glue. Tin holes, unexposed leads, solder balls, etc., covering types |
| Testing Component | 01005chip&0.3 pitch IC |
| Communication Input and Output | Universal I/O Interface |
| Serial port commands and data transmission | |
| Ethernet commands, data, and graphic transmission |
