Copper-clad laminate专用silicon micro powder

Category: Silicon Micro Powder

Keywords: Copper-clad Laminate, High Insulation, High Thermal Conductivity, High Thermal Stability, Acid and Alkali Resistance, Wear Resistance

Description: Our company utilizes natural quartz and other inorganic non-metallic minerals as raw materials to provide high-quality composite soft fillers and crystalline silicon micro粉末 for copper-clad laminates. We optimize product structures according to customer needs, offering reliable and durable products. Silicon micro粉末 for copper-clad laminate applications boasts significant physical properties: three highs – high insulation, high thermal conductivity, and high thermal stability; three lows – low coefficient of thermal expansion, low dielectric constant, and low raw material cost; and two resistances – resistance to acidity and alkalinity, and wear resistance. With the improvement of surface treatment conditions of silicon dioxide, its compatibility with the resin system has been enhanced. Therefore, as a filler in copper-clad laminates, silicon dioxide not only reduces costs but also improves certain properties of the copper-clad laminates (such as coefficient of thermal expansion, flexural strength, and dimensional stability). In summary, from mechanical and electrical properties to cost-effectiveness, our products offer superior performance.

Basic characteristics of soft composite silicon micro powder:

Soft composite silicon micropowders can be differentiated by specifications and customized according to customer requirements based on the following characteristics: