Copper-clad laminate, insulating board specialty silica micro powder

Category: Silicon Micro Powder

Keywords: Copper-clad Laminates for Special Use, High Insulation, High Thermal Conductivity, High Thermal Stability, Acid and Alkali Resistance, Abrasion Resistance

Description: Our company uses natural quartz and other inorganic non-metallic minerals as raw materials to provide high-quality composite soft filling and crystalline silicon micro powder for copper-clad laminates. We optimize the product structure according to customer needs, offering reliable and durable products. Silicon micro powder, used in the copper-clad laminate industry, exhibits significant physical properties: three highs – high insulation, high thermal conductivity, and high thermal stability; three lows – low thermal expansion coefficient, low dielectric constant, and low raw material cost; and two resistances – resistance to acidity and alkalinity, and wear resistance. With the improvement of surface treatment conditions of silicon dioxide, its compatibility with the resin system has been enhanced. Therefore, as a filling material in copper-clad laminates, silicon dioxide not only reduces costs but also improves certain properties of the copper-clad laminates, such as thermal expansion coefficient, bending strength, and dimensional stability. In summary, from mechanical to electrical properties, it offers comprehensive benefits.