Silicon dioxide, utilized in the copper-clad laminate industry, boasts significant physical characteristics: "Three Highs" - high insulation, high thermal conductivity, and high thermal stability; "Three Lows" - low thermal expansion coefficient, low dielectric constant, and low raw material cost; and "Two Durabilities" - resistance to acidity and alkalinity, and wear resistance. With the improvement of surface treatment conditions of silicon dioxide, its compatibility with the resin system has been enhanced. Therefore, when used as a filler in copper-clad laminates, silicon dioxide not only reduces costs but also improves certain properties of the copper-clad laminates, such as thermal expansion coefficient, bending strength, and dimensional stability. In summary, silicon dioxide exhibits advantages in terms of mechanical, electrical, thermal properties, and dispersion within the system.