BN sintered boron nitride boards are high-temperature sintering substrates made with BN ceramic as the core material. They offer high thermal stability, chemical inertness, excellent thermal conductivity, and low thermal expansion coefficient. They are widely used in advanced manufacturing fields such as electronic ceramics, semiconductor chips, and new energy battery materials.

Core features

High-temperature resistance: Maximum operating temperature up to 2100°C, withstanding repeated high and low temperature shocks, suitable for extreme hot environments.

Chemical Stability: Non-reactive with metals and ceramics, non-adhesive to products, to avoid contamination, with a long service life.

High thermal conductivity: Thermal conductivity 10 times that of quartz, ensuring even heat distribution at high temperatures.

Low thermal expansion: Low coefficient of thermal expansion, excellent resistance to thermal shock, reducing the risk of cracking caused by thermal stress.