Surface Cleaning: Remove organic contaminants from the product surface, primarily by eliminating weak bonds (e.g., van der Waals forces).

Organic pollutants, mainly represented by the -CH key types, etc.

Surface Activation: Formation of polar groups on the material surface, primarily in the form of carbonyl groups

(Carbonyl), carboxyl, hydroxyl, and other organic groups

Mister, these polar groups have a positive effect on hydrophilicity and are used to replace weakly hygroscopic materials, mainly applied in

Pre-treatment for bonding and coating.

Surface Etching: Utilizing typical gas mixtures to form highly etching plasmas

The substrate reacts chemically with the organic matrix on the material surface, producing CO, CO2, and H2O vapor.

Gases such as steam are used to achieve the purpose of surface etching.

Surface Coating: Simultaneously introduce two or more process gases into the plasma coating equipment.

Enter the reaction chamber, where gases are cracked in an ionic environment and then re-polymerized to produce new substances.

This application is much stricter than requirements for activation and cleaning. Typical applications include protective layers.

Formed and applied for fuel containers, scratch-resistant surfaces, coatings on materials similar to PTFE (Teflon), waterproof coatings, etc.