I. Introduction

It is widely known that nanomaterials science and engineering have become a global research hotspot. When studying the surface modification of nanomaterials, the concept of wetting contact angle often comes into play. The contact angle refers to the angle formed by the tangents to the gas-liquid and solid-liquid interfaces at the three-phase junction of solid, liquid, and gas when a drop of liquid is placed on a horizontal solid surface, with the liquid phase being enclosed between them.

Surface energy is a measure of the energy required to disrupt intermolecular chemical bonds during the creation of a material's surface. In solid-state physics, surface atoms possess more energy than those within the material, causing them to spontaneously tend towards the interior rather than the surface. Another definition of surface energy is the excess energy of the material's surface compared to its interior.

The force of attraction between any two adjacent parts of a liquid surface, perpendicular to their unit length boundary lines. The formation of surface tension is closely related to the special state of stress experienced by molecules within the thin layer of the liquid surface. The presence of surface tension gives rise to a series of special phenomena observable in everyday life.

Section II: Instrument Application Fields

Industry of TFT-LCD Panels: Measurement of glass panel cleanliness and coating quality; quality measurement of TFT printed circuit, color filter film, ITO conductor film, and other pre-coating materials.

Surface cleanliness and adhesion quality measurement in printing and plastic industries; ink adhesion measurement; adhesive colloidal property compatibility measurement; dye tightness measurement

Semiconductor Industry: Wafer cleanliness measurement; HMDS processing control; CMP research and measurement, photoresist and developer research

Research on S chemical materials: discussions on waterproof and hydrophilic material properties; surface tension and wetting of surfactants and detergents; measurement of viscosity enhancement and adhesion surface energy

IC Packaging: Substrate Surface Cleanliness; Atomic Composition Oxide Identification; BGA Soldering Surface; Epoxy Adhesion Measurement