Product Parameters Details
l Operating Temperature:-120℃-400℃ l Maximum heating rate:35℃/min l Maximum cooling rate:20℃/min l Wafer Size Compatibility:2-12 inches l Evenness of surface temperature:±2% l Temperature Stability:±0.05℃ l Tabletop Flatness:25um | Wafer Heating Plate(Wafer Heating Plate), also known as a heating stage or heater, is used in fields such as semiconductor, chip, OLED optical temperature control, wafer testing, etc. It is primarily used for precise temperature control of wafers during processing to ensure stability and high quality in the manufacturing process. It is suitable for various probe stations and can be used for electrical testing while temperature control is in progress.。 |
ProductModel | WT450-60-8 | |
Temperature Control Module | DimensionsPower | 6-inch disc, 3-4 watt powerKWBase power3-4KW |
Material Requirements | Hot Plate & Cold PlateMaterial SUS316(Please provide the Chinese content you would like translated into American English. 420J2） | |
Temperature Control Range | -120℃～400℃ * | |
Rise Rate | 35℃/min | |
Cooling rate | 20℃/min | |
Wafer Size Compatibility | 2-12 inches | |
Evenness of surface temperature | ±2% | |
Temperature Stability | ±0.05℃ | |
Tabletop flatness | 25um | |
Environmental vacuum degree | 1E-5mbar | |
Countertop Electrical Instruments | Optional ElectricityPlease acceptPlease provide the Chinese content you would like to be translated into American English.Triaxial/Blue Terminal | |
Self-contained system control or integrated control? | Accessory | |
Basic Configuration | Heating plate (one top and one bottom plate)×2 Cooling Water Plate, ×2 Outer Shell Water Plate, Several Cold Water Pipes, ×3 Water Chiller, ×2 Temperature Control System (Temperature Controller. Upper and lower plates can be controlled separately) | |
