3D Microscopic Strain Measurement System
System Introduction
Microscopy Application Measurement System – A combination of optical microscopes and DIC digital image correlation technology, catering to nanometer precision measurement requirements.
3D digital image correlation technology (DIC) boasts accuracy, robustness, and ease of use, and is widely applied in strain measurement. However, for samples requiring high magnification, 3D measurement still struggles to meet the measurement requirements, primarily due to the lack of optical components with sufficient depth of field for obtaining two high-magnification images from different perspectives necessary for 3D analysis. It fills the gap left by traditional equipment in the inability to measure the deformation of tiny objects, emerging as a powerful tool for strain measurement in the microscale domain.
Technical Advantages
- Acquire the 3D coordinates, displacement, and strain data of the entire field
- 3D Display of Measurement Results
- Suitable for any material
- Rapid, simple, and high-precision system calibration
- Measuring area can be freely adjusted: from 1~10mm range
- Stress Measurement Range: from as low as 0.01% to over 500%
- Flexible and easy-to-use trigger function
Application Scope
- Microscopic morphology, strain analysis (micron, nanometer scale)
- Material Testing (Young's Modulus, Poisson's Ratio, Parameters of Elastic-Plastic Properties)
- Stress calculations, flexibility assessments, component size measurements, detection of non-linear changes.
- Advanced materials (CFRP, wood, fibers containing PE, metal foam, rubber, etc.)
- Behavior analysis during uniform and non-uniform material deformation processes
- A variety of gender and non-gender-specific features
- Component testing (measurement of displacement, strain)
- Microscale dynamic strain measurement, such as fatigue testing.
- Biomechanics (skeletal, muscular, vascular, etc.)
- Fracture Mechanics Properties
- Nonlinear change detection
Technical Specifications
