High-frequency hybrid pressing
Number of Layers: 8
Material: F4BM-300
Surface Treatment: Gold Filling
Micro hole: 0.15mm
Fine Line Width: 0.065mm
Small line spacing: 0.065mm
High-density assembly of multi-layer printed circuit boards, compact in size; as the volume of electronic products continues to shrink, the demand for multi-layer PCBs is also increasing.
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