What is COB Soft Packaging

You may notice a blob of black material on some circuit boards. What is this substance, and why is it present on the circuit board? What's its purpose?

Functionally, it is actually a type of encapsulation, which we often refer to as "soft encapsulation." To say it's soft encapsulation is to differentiate it from the "hard" version, as it is composed of epoxy resin.

Typically, the receiving head's face is made of the same material, with a chip IC inside. This process is called "bonding," which we commonly refer to as "soldering."

This is a wire bonding technique in the chip manufacturing process, known as COB (Chip On Board), which stands for chip packaging on board, referring to the direct attachment of bare chips onto the board.

One of the technologies involves using epoxy resin to mount chips on HDI PCB printed circuit boards. Why don't some circuit boards have this kind of packaging? This kind of packaging...

What are the characteristics?

2. Features of COB Packaging

This soft encapsulation technology is often employed for cost reasons, serving as a simple bare chip mounting. To protect the internal IC from damage, such encapsulation typically requires...

One-time molding, generally placed on the copper foil surface of circuit boards, in a circular shape, black in color; this packaging technology features low cost, space-saving, thinness, and lightweight.

The high thermal efficiency and simple packaging methods, among other advantages, have led many integrated circuits, particularly cost-effective ones, to adopt this approach, requiring only the addition of multiple leads to the integrated circuit chip.

Wires are then handed over to the manufacturer, where chips are placed on the circuit boards and焊接 using machines, followed by the application of glue for curing and hardening.

3. Application Scenarios

This packaging, with its unique characteristics, is particularly suitable for electronic circuits such as MP3 players, electronic pianos, digital cameras, and game consoles, appealing to some enthusiasts.

Cost-effective circuit solutions also utilize this packaging.

In fact, COB soft packaging is not limited to chips; it is also widely used in the LED field, such as COB light sources. These are directly mounted on a mirror surface on LED chips.

An integrated surface light source technology on a metal-based substrate.