What are the hole classifications and compositions of automotive camera PCBs?

Through-hole (ia) is a crucial component of automotive camera PCBs, with the cost of drilling typically accounting for 30% to 40% of the overall PCB manufacturing cost for automotive camera PCBs. Simply put,

Come on, every hole on an automotive camera PCB can be called a via. So, what are the classifications and compositions of automotive camera PCB vias?

Classification of Holes

From a functional perspective, holes can be categorized into two types: one for electrical connections between layers, and the other for the fixation or positioning of components. If we consider the manufacturing process,

Holes can be categorized into three types: blind holes, countersunk holes, and through holes.

Blind holes are located on the top and bottom surfaces of the printed circuit board, with a certain depth. They are used for connecting surface-level and inner-level circuits, and the depth of the holes usually does not exceed a certain ratio.

(Aperture)

Holes buried within the inner layer of the printed circuit board do not extend to the board's surface. Both types of holes are located in the inner layer of the PCB and are formed using through-hole molding before lamination.

Art project completed.

Through-hole refers to holes that pass entirely through the printed circuit board, which can be used for internal interconnection or as mounting and positioning holes for components. Due to the ease of implementation in the manufacturing process, through-hole holes are more cost-effective.

Low cost, making it the preferred choice for most automotive camera PCB prototypes.

Composition of the穿孔

From a design perspective, the via is primarily composed of two parts: the central drilled hole, and the pad area surrounding the hole. The size of these two components determines

Hole size. In the design of high-speed, high-density automotive camera circuit boards, designers always aim for the smallest possible holes to maximize the board's routing space.

Line Space. However, while the reduction in hole size brings increased costs, it is also limited by the craftsmanship technologies such as drilling and electroplating: the smaller the hole, the more time-consuming the drilling process becomes.

The longer the time, the more likely it is to deviate from the central position; and when the depth of the hole exceeds 6 times the diameter of the drilling, it cannot be guaranteed that the hole wall can be evenly electroplated with copper.