Ultra-fine Silicon Dioxide Filler
Silicon micro-powder is used in electronic assembly materials, primarily serving as a waterproof, dustproof, gas-proof, vibration-reducing, external force damage-resistant, and circuit stabilizing agent. Adding a high purity ultra-fine and nano-silicon dioxide content of 70-90% or more to epoxy plastic encapsulated electronic materials enables them to possess excellent processability, minimal shrinkage, low thermal expansion coefficient, and good resistance to acids, alkalis, and solvents.
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