Zinc Oxide-Boride-Based Bismuth Salts Glass Powder for Gold and Silver Inks

• Key IngredientsBismuth oxide glass powder, primarily composed of bismuth oxide (Bi₂O₃)
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• Feature
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• Low Melting PointBismuth oxide glass powder has a relatively low melting point, typically around 400℃-600℃，which allows it to soften and melt at lower temperatures during the sintering process of gold paste and silver paste. This facilitates the bonding between the gold paste, silver paste, and the substrate, and also reduces the impact on substrates that are not heat-resistant.
• Excellent chemical stabilityNon-oxidizable in air and resistant to erosion by acidic or alkaline chemicals, ensuring the stability of performance for gold and silver inks under various environmental conditions.

• High insulation propertiesGold and silver conductive phases can be isolated to prevent short circuits, ensuring the electrical performance of gold paste and silver paste in the circuit.

• High Refractive IndexIn applications requiring optical performance, it can be paired with materials such as gold and silver to meet specific optical needs.

The role in gold and silver inks

• Fusibility assistanceDuring the sintering process of gold and silver pastes, boric oxide glass powder can lower the overall sintering temperature, allowing gold and silver powders to achieve excellent sintering at relatively lower temperatures, saving energy, enhancing production efficiency, and also avoiding the negative impact of high temperatures on the properties of gold, silver powders, and the substrate material.

• Enhanced AdhesionOur innovative solution serves as an excellent bridge between gold powder, silver powder, and substrates, enhancing the adhesion of gold and silver inks to materials such as ceramics, glass, and silicon wafers. This ensures that the gold and silver coatings remain securely bonded to the substrates during use, preventing easy detachment.

• Adjusting Electrical PropertiesAdding an appropriate amount of bismuth酸盐 glass powder can adjust the electrical properties of gold and silver paste after curing, such as resistance rate, to better meet the requirements of different electronic components for conductivity.

• Enhance rheologyOur new formulation improves the rheology of gold and silver inks, enhancing their flow and thixotropy during printing or coating processes. This allows for even coating on substrates, resulting in uniformly thick and flat gold and silver films, thereby improving product quality and consistency.

Application Areas

• Electronic Circuit ManufacturingIn the fields of printed circuit boards (PCBs) and integrated circuit (IC) packaging, used for creating gold and silver conductive lines and electrodes, ensuring reliable connections and stable performance of the circuits.

• Solar CellIn solar cell electrode pastes, it assists silver paste in forming a superior ohmic contact with the silicon wafer surface, enhancing the battery's photovoltaic conversion efficiency and stability.

• SensorGold and silver electrodes, as well as conductive lines, are used in the production of various sensors to ensure signal transmission and detection accuracy.

• Electronic ComponentsIn the manufacturing of electronic components such as capacitors, resistors, and inductors, as an essential part of gold paste and silver paste, they play a role in connecting, conducting, and insulating, enhancing the performance and reliability of the components.