PEMTRON BenChuang 3D SPI TROI 7700 Series

3D Inline Solder Paste Inspection System

TROI series - Solder Paste Inspection Equipment

Utilizing Moore pattern image-based BonChuang 3D solder paste inspection equipment.
Unlike previous methods that solely relied on colored images for solder paste inspection,
Synthesized from 2D color images and 3D detection data, providing more detailed and realistic 3D detection images.
Provide users with quick and accurate quantitative information, as well as the necessary details for distinguishing between good and defective products.
Equipped with various statistical software, offering solutions for the production of high-quality and precision PCBs.

PEMTRON Ben创 3D SPI TROI 7700 Series

Reliable Quality Assurance Solutions

• Compared to other SPIs, PEMTRON's SPI has been verified for high precision and repeatability through its proprietary optical system.

• You can utilize various self-developed process management software to identify and statistically analyze process issues, which is an extremely effective method for optimizing processes and enhancing production efficiency.

High-speed, high-precision 3D inspection

• PEMTRON TROI SPI utilizes precision lenses, high-resolution cameras, and fast speed to detect solder paste printing defects.

• Based on high precision and repeatability, capable of handling various conditions for stable inspections.

3D SPI Reinforced SPC System

• The SPC system can analyze defect data and control process issues or production speed.

• SPC data can be saved in various file formats, such as HTML, Excel, and Image. Additionally, the enhanced SPC server functionality allows you to control multiple data sets together or individually.

• Through a comprehensive analysis of various information provided by Data-Driven, ensure a stable and improved production efficiency system.

Closed Loop (Closed-Loop Control)

• By enabling real-time data communication with solder paste printers and pick-and-place machines (surface mount technology), we exchange pad and solder paste position information, fundamentally resolving defects and optimizing the process.