Zinc oxide, boric oxide, and bismuth oxide-based glass powder for gold and silver inks, auxiliary agents for gold and silver inks, etc.

• Main IngredientsBismuth oxide glass powder, primarily composed of bismuth trioxide (Bi₂O₃)
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• Features
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• Low melting pointBismuth oxide glass powder has a relatively low melting point, typically around 400℃-600℃，which allows it to soften and melt at lower temperatures during the sintering process of gold paste and silver paste, promoting the bonding between the paste and the substrate. It also reduces the impact on substrates that are not heat-resistant.
• Excellent chemical stabilityNot prone to oxidation in air and resistant to erosion from acidic and alkaline chemicals, ensuring the stability of the performance of gold and silver inks under various environmental conditions.
• High insulation propertiesEffectively isolates conductive phases such as gold and silver, preventing short circuits and ensuring the electrical performance of gold and silver inks within the circuit.
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• High refractive indexIn applications that require optical performance, it can be matched with the optical properties of materials like gold and silver to meet specific optical requirements.

Role in gold ink and silver ink

• Melting aidDuring the sintering process of gold and silver inks, bismuth oxide glass powder can lower the overall sintering temperature, allowing for effective sintering of gold and silver powders at relatively lower temperatures, saving energy, enhancing production efficiency, and preventing the negative impact of high temperatures on the properties of gold, silver powders, and the base material.
• Enhanced adhesionIt forms an excellent connection bridge between gold powder, silver powder, and the base material, enhancing the adhesion of gold and silver inks to substrates like ceramics, glass, and silicon wafers. This ensures that the gold and silver coatings will not easily peel off from the base material during use.
• Adjust electrical propertiesAdding an appropriate amount of bismuthate glass powder can adjust the electrical properties of gold and silver inks after curing, such as resistivity, to better meet the requirements of various electronic components for conductivity.
• Improve rheologyImproves the rheological properties of gold and silver inks, enhancing their flow and thixotropy during printing or coating processes. Allows for uniform application on substrate surfaces, resulting in evenly coated, smooth gold and silver films, thus improving product quality and consistency.

Application Areas

• Electronic Circuit ManufacturingIn the fields of printed circuit boards (PCBs) and integrated circuit (IC) packaging, used for creating gold and silver conductive tracks and electrodes, ensuring reliable connections and stable performance of the circuit.
• Solar PanelsIn solar cell electrode pastes, assists silver paste in forming a good ohmic contact with the silicon wafer surface, enhancing the battery's photoelectric conversion efficiency and stability.
• SensorGold and silver electrodes and conductive lines for various sensors, ensuring signal transmission and detection accuracy of the sensors.
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• Electronic ComponentsIn the manufacturing of electronic components such as capacitors, resistors, and inductors, gold paste and silver paste, as an essential part, play a role in connecting, conducting electricity, and insulating, enhancing the performance and reliability of the components.