Compact and versatile, the MAPS series can handle full-range vibration.
The Mingli Jingji MAPS series products feature a vibration damping system that is an assembled vibration damping device, incorporating a pressure-driven actuator for both vertical and horizontal use within a cleverly designed shape. With the use of a set of four, it corresponds to full-degree-of-freedom vibration and can deliver excellent vibration damping, control, and positioning capabilities.
MAPS can eliminate the vibration in the difficult frequency range of passive vibration suppression.
Passive vibration damping is not always sufficient due to resonance issues caused by inherent vibrations; however, these can be eliminated through active control, which also offers excellent vibration damping performance within the given frequency range. For instance, in the low-frequency vibration domain around 2Hz, where passive damping is less effective, active vibration control can reduce the vibration to below 1/30 to 1/100 compared to passive damping.
Standard MAPS equipment capable of vibration isolation over 10 tons
In recent years, precision equipment has become increasingly large-scale with the enhancement of its functionalities. Equipment weighing over 10 tons has already been developed. Due to the difficulty in maintaining high inherent frequencies with the large size of the equipment, low-frequency vibrations, which were previously not much of an issue, now easily affect the equipment. This is also a reason why an active vibration damping system with excellent low-frequency vibration attenuation performance is essential.
MAPS boasts excellent precise positioning and precision leveling capabilities.
If the equipment becomes larger, tilting becomes an issue. Due to the equipment's own weight, tilting can cause bending, leading to significant impacts on accuracy. Since MAPS is controlled after fully considering precision leveling performance, it can suppress tilting and maintain accuracy. Secondly, MAPS controls after precise positioning, ensuring smooth transfer of wafers and LCD panels.
