Product Description: Primarily used for double-sided lapping or polishing of thin, brittle metals or non-metals such as silicon wafers, quartz crystal wafers, SMD surface mount crystals, optical crystals, glass, lithium niobate, ceramic sheets, etc.

Product Advantages

1. The machine features a touch screen and PLC programmable control.

2. Driven by an AC variable-frequency motor, featuring soft start, soft stop, stable and reliable operation with minimal shock.

3. Hydraulic lifting sprocket with exceptional stability. The sun gear features shims for position adjustment, effectively utilizing the sprocket and sun gear.

4. The equipment can independently control pressure, and parameters such as pressure magnitude, machine speed, the number of rotations at that pressure state, and speed ratio settings can all be programmed and controlled according to process requirements.

5. The grinding disc can be adjusted using the revision method.

6. Compatible with ALC (Frequency Monitor) connection