The IPS5200S is Angco's high-performance automated burning machine with four nozzles, capable of accommodating up to 4 powerful Angco burning cores AP8000. The system can be expanded to 32 or 64 burning stations, providing clients with efficient and cost-effective production capacity utilization.
●Angco's trusted IPS automatic machine frame, ensuring stable and reliable performance throughout the entire lifespan of the machine
● Newly designed four-nozzle chip pick-and-place system, achieving high-speed and efficiency (UPH 3500) while also ensuring precision in pick-and-place and ultra-quiet operation
● High-performance servo drive system paired with high-precision ball screw transmission system, achieving a combination of ultra-high precision and ultra-high productivity efficiency
● The system supports various small-sized package burn-in
● Interface with MES Manufacturing Execution System for full control and traceability of the production process
Featured Features
High-output Universal Burner AP8000
● Built-in with 4 burners and 32 or 64 recording stations
Up to 3,500 UPH (Units Per Hour)
● Supported IC Types: UFS, eMMC, Nor/Nand Flash, EEPROM, CPLD, FPGA, Anti-Fuse, and other customer-customized chips/modules
Support various IC packaging types
Intelligent Image System
● Four downward cameras (1.3MP) with IC synchronization and skew correction, one upward camera (1.3MP) for positioning at each work station (including trays, material belts, burning seats, etc.)
● Fully automatic IC outline positioning, eliminating traditional membrane plate matching, making operation easier and more user-friendly
● High-precision identification of small chips, supporting 1.0x1.5mm chip packaging
● More precise IC pick and place, ensuring stable chip handling and high yield
High output and high reliability
● Four-nozzle high-precision IC pick and place component
● UPH up to 3,500
● Automated real-time material stacking detection
Automatic Infeed and Outfeed Tray (AutoTray System)
● Efficient automatic tray system, loading and unloading do not affect UPH
● The automatic tray system is simple and reliable, enhancing system stability.
Automatic Roll Out Equipment (Tape Out)
● Supports both cold-seal and heat-seal packaging
● Supports tape widths from 8 to 44mm
High-precision stepping feed (+/- 0.04 mm)
Ink Drop Mechanism & Inkjet Printer
Optional semiconductor-specific dotting mechanism and inkjet printing device
● Supports automatic unwinding and automatic tray device marking
✓ Supports dot and character printing
✓ Supports a variety of colors
✅ Ink meets RoHS requirements
Product Specifications Sheet
