XPS board size specification: 1200 * 600mm (customizable) * 10-120mm Suitable temperature: -50 ° C to+70 ° C Water absorption rate ≤ 1.5 (V/v)% Compressive strength ≥ 250KPA Thermal conductivity ≤ 0.030
Product introduction: There are many closed bubble structures formed in the board, which have the characteristics of strong pressure bearing force, good waterproof performance, chemical corrosion resistance and strong anti-aging ability, and are widely used in building insulation and waterproof and moisture-proof in humid environment. The development time of extruded insulation board in China with practical significance is only about 10 years. However, in recent years, through the vigorous promotion of various production enterprises, it has gradually gained recognition from industry insiders in the construction industry and has a large coverage area in major economic regions in China. In the foreseeable future, this market will continue to grow, and there is still room for improvement in domestic production capacity.
Features: XPS board has a closed cell honeycomb structure, which makes it lower in water absorption, thermal conductivity, and vapor permeability than other types of board shaped insulation materials. Therefore, it has the characteristics of high compression resistance, lightweight, air tightness, corrosion resistance, and non degradation. XPS board is an extremely common thermal insulation material in European and American countries, especially suitable for roof insulation systems, freezers, insulation inside and outside walls, home decoration, etc. that use inverted roof insulation technology (up shutdown). This product is suitable for roof insulation layer, and has advantages over traditional perlite in terms of insulation effect, ease of construction, total cost, and service life. It is a new type of environmentally friendly and energy-saving material.
The thermal conductivity of XPS/extruded board is less than or equal to 0.028w/mk, far lower than other insulation materials, therefore it has the characteristics of high thermal resistance and low linear expansion rate.
