Equipment Features

Smart 3DH

High precision, high efficiency, and high repeatability; measurable height: 25mm, Z-axis repeatability accuracy ≤10um.

Chip offset, chip angle offset, chip surface contamination, chip adhesive reversal, chip thickness anomaly, Die encapsulant height testing.

Detects product collinearity and coplanarity.

Automated training servers, with AI models automatically updated through data iteration.

AI Rapid Programming, 5-minute coding, one-click operation

Remote control, minimize manual labor, enhance efficiency.

QR code intelligent recognition, compatible with MES system integration.

Product Specifications