Product ID: 03.05.01
Miniaturization and high capacitance of stacked ceramic chip capacitors are achieved by pursuing ultra-fine particle size through advanced material technology. Utilizing process technology, a highly stacked technology without misalignment between the dielectric and electrode layers, as well as a multilayer technology with up to 1000 layers, has been established. The interlayer thickness of a single layer reaches sub-micron levels. By pursuing thin-layer and multilayer structures, even small-sized chip capacitors can achieve both large capacitance close to tantalum capacitors and high reliability.

The C Series MLCCs are general-purpose MLCCs, not designed for specific applications.

The C series voltage-resistant MLCCs are suitable for various applications requiring rated voltages between 100V and 630V.

The C Series high-voltage MLCC is suitable for various applications requiring rated voltages between 1000V and 3000V.

The CGA series MLCC is suitable for applications that require compliance with the CDF-AEC-Q200 industrial standards.