Nippon Denso Reflow Oven

Process Flow:

The surface mount boards processed by reflow soldering have a complex process, which can be divided into two types: single-sided mounting and double-sided mounting.

Single-Sided Mounting: Pre-coated Solder Paste → SMT (Split into Manual Mounting and Automatic Machine Mounting) → Reflow Soldering → Inspection and Electrical Testing.

Double-Sided SMT Assembly: A-Side pre-coated solder paste → SMT placement (manual and automatic machine placement) → Reflow soldering → B-Side pre-coated solder paste → SMT placement (manual and automatic machine placement) → Reflow soldering → Inspection and electrical testing.

The purpose of process control is to achieve the required quality and the lowest possible cost. Previously, process control was mainly focused on detecting defects to improve quality; however, its fundamental内涵 has evolved to include continuous monitoring of various processes and identifying deviations that do not meet specifications. Process control is the ability to obtain relevant data from specific operations that influence the final outcome, allowing for real-time receipt of information about potential issues, the implementation of corrective measures, and immediate adjustment of the process to optimal conditions. True process control involves monitoring actual process data, which in the context of reflow soldering process control, means monitoring the thermal curves of every board manufactured.

The intelligent reflow oven is equipped with an integrated computer control system, which allows for easy input of various data in a Windows operating environment. It can quickly retrieve or replace reflow soldering process curves from memory, saving adjustment time and enhancing production efficiency.

Due to the need for continuous miniaturization of electronic product PCB boards, chip components have emerged, and traditional welding methods are no longer suitable. Initially, reflow soldering technology was only used in the assembly of hybrid integrated circuit boards, with most assembled and焊接 components being chip capacitors, chip inductors, surface mount transistors, and diodes, etc. As SMT technology has developed more完善, the emergence of various surface mount components (SMC) and devices (SMD) has led to corresponding development in reflow soldering technology and equipment, which is part of the assembly technology. Its application has become increasingly widespread, now being used almost in all electronic product fields.

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