Wet Etching Machine

Application: Wafer Etching Cleaning

Applicable Fields: Semiconductor Materials, MEMS, etc.

Applicable Processes: Acid etching, alkaline etching, ultrasonic (megasonic) cleaning, QDR cleaning, etc.

Etching Methods:槽式蚀刻,单点蚀刻

Operation Mode: Semi-Automatic/Automatic

Cleanable Size: 2" - 12" wafers

Frame made of full stainless steel, with imported PP, PVC panels as the outer layer

Temperature Control Accuracy ±1℃

Transfer Time: Chute transfer time less than 2 seconds

Safety Protection: Automatic Safety Doors, Leak Alarm, Electric Leakage Protection, Liquid Level Protection, Emergency Stop, Audio-Visual Alarm System

Modular design to meet customers' customized requirements for various processes and production capacities

     Programmable menu, user-friendly and intuitive

     Real-time process display with strong controllability

     Multi-level password, easy to manage, secure and reliable

     Automatically save production data

     Remote control capability

Functionality: Management System (Automatic Fluid Supply, Automatic Refilling, Recirculating Filtration), Online Heating, Conductivity Detection, Temperature Control System, 100 Class FFU