Application

Wafer electroplating

Operation Method

Manual/Semi-Automatic/Automatic

Applicable Fields

Wafer electroplating for semiconductor, LED, MEMS, and other microelectronics fields

Applicable Technology

Silicon, gallium arsenide, gallium nitride, silicon carbide, indium phosphide, and other semiconductor materials and devices.

Electroplating Sizes

212 inches

Electroplating Method

槽式电镀槽

Electroplating Type

Single-Sided Electroplating, Double-Sided Electroplating

Plating Quantity

1-4Sheet

Coating Types

Copper, gold, silver, nickel, tin, and other metals

Electroplating method

Full surface plating, blind hole electroplating, TSV porous electroplating

Electroplating Power Supply

Direct current, single pulse, double pulse

Current adjustable from 1 to 10,000mA, constant current control accuracy of 1mA

Anode

Soluble/Insoluble Anode

Cathode Clamp

Customized

Electroplating Tank

Cathode movement, electroplating solution circulation filtration, electroplating solution heating

Cleaning tank

Spray, nitrogen bubbling, rapid drainage

Supply

Manual, Automatic

Main Material

PP、PVC

Trough material

NPP、PVC、PVDF

Temperature Control Accuracy

±1℃

Safety Protection

Automatic safety door, leak detection alarm, electric leakage protection, liquid level protection, emergency stop, sound and light alarm system

Modular design

Meet customers' customized requirements for various processes and production capacities.

Programmable menu for easy user operation, intuitive.

Real-time process display with strong controllability.

Multi-level password, easy to manage, secure and reliable

Automatically save production data

Remote control capability

Features enabled

Management System, Cathode Movement, Online PH Monitoring