Equipment Name: Wet Etching Machine

Application: Wafer Etching Cleaning

Applicable Fields: Semiconductor Materials, MEMS, etc.

Applicable Processes: Acid etching, alkaline etching, ultrasonic (megasonic) cleaning, QDR cleaning, etc.

Etching Methods:槽式Etching, Single-Wafer Etching

Operation Mode: Semi-Automatic/Automatic

Cleanable Diameter: 2" - 12" Wafer

Full stainless steel frame, with imported PP, PVC panels.

Temperature Control Accuracy ±1℃

Transfer Time: Chute transfer time less than 2 seconds

Safety Protection: Automatic Safety Doors, Leak Detection Alarms, Electrical Leakage Protection, Liquid Level Protection, Emergency Stop, Audio-Visual Alarm Systems

Modular design to meet customers' customized requirements for various processes and production capacities

     Programmable menu for easy user operation, intuitive

     Live process display with strong controllability.

     Multi-level password, easy to manage, secure and reliable

     Automatically save production data

     Can be remotely controlled

Features: Management System (Automatic Liquid Supply, Automatic Refilling, Recirculating Filtration), Online Heating, Conductivity Measurement,恒温 System, 100 Class FFU