Single-Unit Washer

Usage: Cleaning and spin-drying of wafers and masks

Operation Method: Automatic

Applicable Fields: Semiconductor Materials, Integrated Circuits, MEMS, LED Chips, Power Devices, etc.

Applicable Processes: Wafer RCA Cleaning, Megasonic Cleaning and Spin-Dry, Two-Fluid Cleaning, Brush Cleaning, Spin-Coating, etc.

Cleaning Method: Swirl-type Washing Nozzle, Megasonic DIW Cleaning

Cleanable Size: 2" - 12" Wafers

Vacuum Value: The display synchronizes and shows values up to ≤-90 KPa.

ZaoSheng Cleaning - ZaoSheng Frequency available in 280-950KHz range, adjustable power.

Servo Motor - Utilizes imported specialized rotating motor, operates quietly and stably, accelerates from 0 to 3500 RPM+ per second in just 0.5 seconds.

Vacuum Suction Cups - Made of PEEK and PTFE materials, featuring high strength, excellent corrosion resistance, and good sealing performance.

Charging Stage - Utilizes vacuum吸附 and PIN positioning to prevent film fragments.

Material: Stainless Steel, PP, PVC

Tank Material: Stainless Steel, PP, PVDF

Safety Protection: Automatic Safety Doors, Leak Detection Alarms, Audible and Visual Alarm Systems

Modular design

Meet customers' customized requirements for various processes and production capacities.

Programmable menu for user convenience, intuitive

Real-time process display with strong controllability

Multi-level password, easy to manage, secure and reliable

Automatically save production data

Features: Robotic Module Assembly and Retrieval

Adjustable brush for cleaning

Chemical liquids and pure water automatic supply with adjustable and visible flow rate

Remote control capability