Excellent thermal conductivity 1.0 W/mK ~ 9.0 W/mK
Self-adhesive without the need for additional surface adhesive
High compressibility, soft yet elastic, suitable for low-pressure application environments
Available in a variety of thickness options.
Product Applications:

Radiator base or frame
High-speed hard disk drive
RDRAM Memory Modules
Miniature Heat Pipe Heat Sink
Automotive Engine Control Unit
Communication Hardware
Portable Electronic Device
Semiconductor Automatic Testing Equipment

Detailed Description: Usage:

Control boards for electronic appliances, internal and external pads and foot pads for motors, materials for electronic appliances, automotive mechanics, computer towers, notebook computers, DVDs, VCDs, and any materials requiring filling and heat dissipation modules.

1. TFT-LCD laptop computers, computer main units

2. Power devices (power supplies, computers, telecommunications), automotive electronic modules (engine cleaner), power modules, high-power power supplies, calculator applications (CPU, GPU, USICS, hard drives), and any areas requiring heat dissipation.

IC Application

3. Heat dissipation devices (integrated circuits, power transistors, thyristors, transformers, etc.) for electronic and electrical products are in close contact with the heat dissipation facilities (heat sinks, aluminum enclosures, etc.) to achieve better thermal conductivity.

4. High-power LED lighting, high-power LED spotlights, street lights, fluorescent lights, etc.

Typical Applications: Customers can select the appropriate thickness of thermal conductive silicone pads based on the gap size between the heat source and the heat sink, with a temperature resistance range of (-40～+220) degrees Celsius.

Color adjustable, thickness optional.