This product is a heat-conductive double-sided adhesive with a base material containing glass fiber, offering good strength and resistance to tearing. It can withstand temperatures above 120 degrees Celsius for extended periods. It boasts excellent thermal conductivity and an adhesive strength of up to 30 MPa, with the bonding strength improving as the temperature rises. The product is used for thermal bonding between heat sources and radiators and is suitable for flat bonding surfaces, such as LED panel lights, fluorescent lights, and cylinder lights, etc. The product can be processed into rolls and sheets. Welcome customers to send us drawings and samples for customization. Our company is dedicated to serving you with competitive prices.！
One. Thermal Double-Sided Adhesive
Thermal conductive double-sided tape is made by filling thermally conductive ceramic powder with acrylic polymer and compounded with silicone adhesive, featuring high thermal conductivity and insulation properties. It also boasts flexibility, compressibility, adhesion, and strong bonding power. It has a wide temperature range and can fill uneven surfaces, tightly and securely adhering to heat sources and heat sinks to rapidly conduct heat away. It is easy to operate and highly efficient; simply peel off the release paper, apply the adhesive side to the device surface, and press lightly for immediate bonding.
Section II: Product Applications:
Electronic Components: ICs, CPUs, MOS
2. LED lighting, M/B, PS, Heat Sink, LCD-TV, NB, PC, etc.
3. DDRLL Module, DVD Applications
4. Designed for interfaces with high surface flatness, such as CPU and LED aluminum substrates
Section 3: Product Specifications
Thickness (mm):0.1mm、0.15mm、0.2mm、0.25mm、0.3mm、0.4mm、0.5mm
Base Material Type | Glass Fiber | Glass Fiber | Glass Fiber | Glass Fiber | Glass Fiber | Glass Fiber | |
Color | White | White | White | White | White | White | |
Thickness | 0.1mm | 0.15mm | 0.2mm | 0.25mm | 0.3mm | 0.5mm | |
180Peel strength | ＞13 | ＞14 | ＞15 | ＞16 | ＞17 | ＞18 | |
Thermal resistance
| Long-termC
|
120 |
120 |
120 |
120 |
120 |
120 |
Short-termC | 180 | 180 | 180 | 180 | 180 | 180 | |
Retention Strength | ＞48 | ＞48 | ＞48 | ＞48 | ＞48 | ＞48 | |
NextForcekg/inch） | 1.1 | 1.4 | 1.4 | 1.4 | 1.5 | 1.5 | |
Dielectric Strength (kV) | 2 | 2.5 | 3.5 | 4 | 6 | 7 | |
Initial Adhesionkg/inch） | 0.6 | 1.3 | 1.3 | 1.3 | 1.3 | 1.5 | |
Thermal Conductivity(W/(m·k)) | 0.8-1.5 | ||||||
Temperature Range | -20°C～+120°C | ||||||
Storage and Shelf Life | To maintain performance, temperature must be kept at:23°C±5°CRelative humidity is:60%±10% to be stored in the original packaging; otherwise, use the product within 15 months from the date of manufacture. | ||||||
IV. Product Features:
1. Thin heat dissipation interface with excellent thermal conductivity
2. Features excellent insulation strength and long-term temperature resistance, with a temperature range of -30~200°C, maintaining long-term shape retention.
3. Low stress: Excellent compressive and tensile properties, vibration resistance
4. Easy to process, with excellent conformity.
V. Applicable Methods:
The surface to be bonded should be cleaned and dried to achieve optimal adhesion. After accurately positioning the gasket, bond it to the substrate. Before installing the components, remove the plastic protective film from this product.
