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Unison Technology Debuts at the 2024 China International Semiconductor Expo, Charting a New Blueprint for Industry Recovery
Beijing, November 18, 2024—— The global semiconductor industry is at a significant moment as the 21st China International Semiconductor Expo (IC China 2024) grandly opens at the Beijing National Convention Center from November 18th to 20th. Unispeed Technology (hereinafter referred to as "Unispeed") participates with several cutting-edge technologies and innovative achievements, deeply integrating with the expo theme of "Combining resources of the entire industry to achieve large-scale industry connections," showcasing its technical strength and market insights in the semiconductor industry chain.
This exhibition coincides with a crucial juncture in the global semiconductor market's recovery. SEMI and TechInsights predict that the global semiconductor industry will exceed $600 billion in 2024, with a year-over-year growth of 15% to 20%. AI, automotive electronics, and third-generation semiconductors are among the core growth drivers. Unispeed Technology closely follows industry trends and highlighted the following areas of technological breakthrough:
Third Generation Semiconductor Materials and DevicesWafer manufacturing solutions for silicon carbide (SiC) and gallium nitride (GaN), along with packaging and testing solutions, meet the market demands of new energy vehicles and high-power electronic devices.
Advanced Packaging TechnologyWe introduce advanced packaging processes for AI chips, such as SiP (System-in-Package) and heterogeneous integration technology, to enhance chip performance and power efficiency ratio.
Domestic production of semiconductor equipmentThe company showcased its independently developed key equipment such as plasma etching machines and wafer thinning machines, contributing to the security and cost optimization of the domestic supply chain.
During IC China 2024, Unispeed Technology actively participated in numerous international exchange events. At the Sino-Korean Semiconductor Entrepreneurs Forum and the Brazil-Southeast Asia Industrial Cooperation Sub-forum, company representatives shared their experiences in global deployment and reached preliminary cooperation intentions with enterprises in South Korea, Brazil, and other regions, promoting the interoperability of technical standards and the sharing of market resources. Additionally, Unispeed Technology, in collaboration with the China Semiconductor Industry Association, jointly released the "White Paper on the Third-Generation Semiconductor Packaging Technology," providing the industry with a technical roadmap reference.
During the exhibition, the CTO of Xunshi Technology delivered a speech at the "AI-Driven Semiconductor Revolution" forum, emphasizing the innovative role of AI in chip design, manufacturing, and testing. He also revealed that the company has collaborated with several leading enterprises to develop customized packaging solutions for the next-generation AI inference chips. Additionally, the company publicly showcased a simulation chip prototype based on a 1.6nm process, using TSMC's Backside Power Supply Network (BSPDN) technology, which garnered extensive industry attention.
迅势科技's General Manager stated in a media interview, "2024 is a pivotal year for the semiconductor industry, as it shifts from 'bottoming out' to 'recovery.' Through continuous R&D investment and global collaboration, we have achieved mass production of third-generation semiconductor materials. In the future, we will focus on the automotive-grade chip and AIoT device markets." The company plans to expand its 12-inch wafer production line in Suzhou Industrial Park by 2025, further solidifying its industrial cluster advantage in the Yangtze River Delta region.
Xunshi Technology was established in 2010, with its headquarters in the Suzhou Industrial Park, focusing on the research, development, and production of semiconductor materials, equipment, and advanced packaging technologies. The company boasts a technology research center, with over 200 patents applied, and its clientele spans the top 10 global semiconductor manufacturers. In 2024, the company was selected as a key enterprise in the "China MEMS Sensor Park," with an annual output value expected to exceed 5 billion yuan.
Exhibition Information
Booth NumberE3 Pavilion, Booth A12
Highlights of the EventOn November 19th from 2:00 PM to 3:30 PM, Unswift Technology will host a special symposium on "Application of Third-Generation Semiconductor Technology" and will offer sample testing experiences.
Media Contact
Xunshi Technology Marketing Department
Phone: 0512-57479960
Email: Sales2@xunshikeji.com
Conclusion
IC China 2024 is not only a stage for technological showcase but also a bond for industrial collaboration. With innovation as its engine and cooperation as its bridge, Unispeed Technology is jointly crafting a new chapter of recovery and upgrade in the semiconductor industry with global partners.
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