详情描述


FT-3120B Semi-Automatic Four-Terminal Tester

 

Function Description: Functionnal description

Four-point probe standard testing method, utilizing a stepping system for automatic control of probe contact with the sample, minimizing the impact of human factors on test results; Referenced to A.S.T.M standards; Measures resistance, resistivity, conductivity data, and enables automatic or manual point measurement through PC software data collection and processing; Repeat testing at the same location or multi-point sheet resistance measurement, with data statistical analysis output; Provides standard calibration resistors; Automatic positive/negative current output, automatic positive/negative voltage measurement

Scope of Application

Wafer, amorphous/silicon carbide and conductive film resistivity measurement; selective emitter diffusion wafers; surface passivation wafers; crossbar finger PN junction diffusion wafers; new electrode designs, such as electroplated copper resistance measurement, etc.; semiconductor material analysis, piezoelectric materials, nanomaterials, solar cells, LCDs, OLEDs, touchscreens, etc.

FT-3120B Semi-Automatic Four-Terminal Probe Tester

Technical Specifications

Model and Specifications

FT-3120B

1.Resistor

10^-5～2×10^5Ω

2.Square Resistance

10^-5～2×10^5Ω/□

3.Resistivity

10^-6～2×10^6Ω-cm

4.Test Current

0.1μA.μA.0μA，100µA，1mA，10mA，100mA

5.Current Accuracy

±0.1%

6.Resistance Accuracy

≤0.3%

7.PCSoftware Operation

PCSoftware Interface: Resistance, Resistivity, Conductivity, Sheet Resistance, Temperature, Unit Conversion, Current, Voltage, Probe Shape, Probe Spacing, ThicknessData Management Analysis, Large/Low value, mean value, variance, coefficient of variation, sample number, test point count report generation, etc.

8.Probe Range Selection:

Probe pressure is100-550gBased on sample contact requirements, adjustments are needed.

9.ExploreNeedle

Insulation Resistance Between Needles: ≥1000MΩ; Mechanical Hysteresis: ≤0.3%

Round head copper-plated gold, tungsten steel material, probe spacing1mm；2mm；3mmOptional accessoriesOther specifications are customizable.

10.Testable Chip

Size Selection

Wafer Size:2-12N/A（6Inch150mm，12Inch300mm）；

Square Sheets: Up to156mm X 156mm Or125mm X 125mm

11. Analytical Mode

Automatic or Manual Single-point Mode

12. Pressure Application Method

Measurement Repeatability: Repeatability ≤3% 

13. Protective Functions

Limited range with pressure protection

14. Test Environment

Lab environment

15. Power Supply

AC 220V±10%, 50Hz, Power Consumption: <100W

16. Selection Items

Computers and printers