Maturely applied in FPC/PCB products such as new energy, reinforcement, multi-layer boards, and soft-hard combined boards; material lamination in speaker components, and composite material bonding.

Product Features

Heat-resistant

Low moisture absorbency

Mechanical and dielectric properties

Leveling and filling properties

Low peel force, high transferability of adhesive layer

Halogen-free, compliant with ROHS and other environmental regulations

Note：

1. Packaged in dry, sealed conditions; store at 5-10°C, with relative humidity ≤65%; shelf life is 3 months during storage.

2. Sample Making Method: Use pure PI reinforcement and pure PI reinforcement lamination; (the reinforcement sheet should be baked at 120℃ for 5 minutes before lamination with the adhesive film).

PI Coating Film Application:

Cover and protect FPC lines to enhance the bendability of FPC.
2. Protect the circuit from damage caused by temperature, humidity, pollutants, or corrosive substances.
3. Cover for the surface treatment of the FPC in subsequent processing.
4. In the subsequent SMT of FPC, it serves as a solder mask.

AD Overcoat Film Features:

1. Suitable for both traditional and rapid lamination methods.

2. Excellent long-term heat resistance and high peel strength.

3. Excellent excess glue control.

4. Excellent flexibility, suitable for high bendable soft boards.

5. Excellent chemical resistance and flame retardancy (UL-94V0).

6. Good storage stability.

7. Compliant with RoHS directive requirements.