This series of products is manufactured using formulas from Japan's FUJIMI Co. and the US's Dupont (DUPON), suitable for semiconductor materials like silicon wafers, germanium single crystal wafers, gallium arsenide wafers, hard disk glass, sapphire wafers, and silicon carbide wafers, for chemical mechanical polishing (CMP) processes. They feature high removal rates, ease of use, and excellent polishing results. After polishing, the surface roughness of the wafers can reach below 0.2um, and they can also improve the roughness and parallelism of the wafers, with no scratches and no polishing mist. While providing high-quality products to customers, our company also reduces processing costs. This series is an excellent choice for replacing imported products.

Property: This product is a milky colloidal aqueous solution, non-toxic and odorless.

Features

High removal rate: Reduces the time required for polishing processes, enhancing production efficiency, reusable, with a high dilution ratio.

2: Easy to Use: This polish is suitable for general polishing processes.

3: Excellent polishing effect: The polished surface has good roughness, no scratches, and no polishing fog will appear.

Application Range and Parameters

This series is used for polishing single crystal silicon wafers, including direct-drawn and zone-melted types with diameters φ76-150mm, as well as doped silicon wafers, both single and double-sided. It is also suitable for polishing other semiconductor materials such as sapphire, germanium slices, and gallium arsenide slices. Additionally, it is employed in the polishing process of optical crystal materials like lithium niobate.