This series of products is manufactured using formulas from Japan's FUJIMI Corporation and the US-based DUPON Company, suitable for semiconductor materials such as silicon wafers, germanium single crystal wafers, gallium arsenide crystal wafers, hard disk glass, sapphire wafers, and silicon carbide wafers. They are designed for (CMP) chemical surface polishing processes, featuring high removal rates, ease of use, and excellent polishing results. The roughness of the wafer surface after polishing can reach below 0.2um, while also improving the roughness and parallelism of the wafers, with no scratches and no polishing mist. Our company provides high-quality products to users while also reducing processing costs, making this series an excellent choice for replacing imported products.

Properties: This product is a milky colloidal aqueous solution, non-toxic and odorless.

Features

High removal rate: Reduces the time required for polishing process, enhances production efficiency, recyclable, with a high dilution ratio.

2: Easy to Use: This polishing fluid is suitable for general polishing processes.

3: Excellent polishing effect: The polished surface has good roughness and no scratches, no polishing mist will appear.

Application Range and Parameters

This series is suitable for polishing single-sided and double-sided original silicon wafers and doped silicon wafers with diameters φ76-150mm, as well as for polishing processes of other semiconductor materials such as sapphire, germanium slices, and gallium arsenide slices. Additionally, it is used for polishing optical crystal materials like lithium niobate.