01 Product Features
High-precision sticker applicator is suitable for high-accuracy positioning and bonding of auxiliary materials on mobile phone and tablet casings, freeing up a large amount of labor. It quickly picks up the required bonding materials without damaging the products, corrects the position and angle deviations of the picked-up materials through a visual system, and then quickly and accurately bonds all the picked-up materials to the product positions.
02 Equipment Specifications
| Project | GT2A |
| Pick and place speed | 1500~2000PCS/H |
| Pick and place accuracy | ±0.1mm |
| Application Range | 200*250mm |
| Debugging Time | ＜20min |
| Label Size | 2×2～35×35mm |
| Dimensions | Approx. 900 (L) * 1150 (W) * 1550 (H) mm |
| Material arrives | 1 unit |
| Weight | Approx. 700 Kg |
| Power Supply | Single-phase AC 200-240V, 50/60Hz |
| Power | 2.5KW |
| Gas Source | 0.5~0.7MPa |
03 Application Scope
Replace workers with tasks such as installing pressure-sensitive adhesives, PI, conductive adhesives, foams, sponges, Mylar, double-sided tapes, thermal conductive silicones, heat dissipation graphite sheets, shielding caps, labels, and protective films. The illustration of the mobile phone frame product is as follows:
