Burned Memory Chip_SupplyPro Co., Ltd._Dongguan Hailuo Electronics Technology Co., Ltd. 
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Dongguan Hailuo Electronics Technology Co., Ltd.

Offer a one-stop service for IC wafer foundry, sockets, burn-in sockets, burn...

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Home > SupplyPro Co., Ltd. > Burned Memory Chip
Burned Memory Chip
品牌: Heroin
Type:
Specs: By chip
Material: Silicon, glass
单价: 电议
最小起订Quantity:
供货总Quantity:
有效期至: 长期有效
最后更新: 2023-09-25 11:00
 
详细Info

We offer recording services for various material types, including tube packaging, tray packaging, and coil packaging. Support for common IC packaging is available, and we can develop corresponding algorithms for recording operations.

1. Rapid mass production, quick delivery

Full range of automated burning equipment and universal programmers on-site, catering to clients' quick mass production delivery requirements and ensuring product quality.

Operate strictly in accordance with the ISO9001 production process management to ensure the implementation of quality control measures.

The entire factory implements static protection measures, in compliance with international ESD standards.

We closely collaborate with several express companies to ensure timely delivery of goods.

Section II: Intelligent Operation Process Management System

Herol Intelligent Process Management System, effectively ensuring the safe entry and exit of various different devices

Software updates, hardware maintenance

Professional electronic engineer available for maintenance services and development of programming tools at any time.

Real-time software updates and special feature software writing services

Section 3: Information Security Prevention

Implement strict record burning archive management and establish a "Confidentiality Agreement" with customers to ensure their intellectual property.

Insure for delivery and financial protection to ensure the safety of goods

1. IC Types: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SD Card, TF Card, CF Card, eMMC Card, eMMC, MoviNand, OneNand...

IC Packaging: DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN…

3. IC Packaging: Tray, Tube, Tape interconversion

4. IC Manufacturers: SanDisk, Toshiba, Micron, Samsung, AMD, SST, Intel, AMIC, Winbond, Atmel, Holtek, Fujitsu...

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