Available for various material types, including tube, tray, and roll packaging, suitable for burning. Supports common IC packaging types and can accommodate algorithm burning operations for market-standard ICs.

Quick mass production, fast delivery

A variety of fully automated burning equipment and general-purpose programmers on-site to meet customer's fast mass production delivery requirements and ensure product quality.

Comply strictly with ISO9001 production process management to ensure the implementation of quality control measures.

Electrostatic discharge (ESD) protection measures are fully implemented across the entire factory, in compliance with international ESD standards.

We closely collaborate with several courier companies to ensure timely delivery of goods.

Section II: Intelligent Operation Process Management System

Herlo Intelligent Process Management System, effectively ensures the safe warehousing and dispatch of various different devices

Software updates, hardware maintenance

Professional electronic engineers available for maintenance services and development of tools for programmers at any time.

Real-time software updates and specialized software writing services

Section 3: Information Security Prevention

Strictly implement record burning file management and establish a "Confidentiality Agreement" with customers to ensure the protection of their intellectual property.

Insure for delivery and financial protection to ensure the safety of goods

1. IC Types: MCU/MPU, EPROM, EEPROM, FLASH, Nand Flash, PLD/CPLD, SD Card, TF Card, CF Card, eMMC Card, eMMC, MoviNand, OneNand...

2. IC Packaging: DIP/SDIP/SOP/MSOP/QSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN…

3. IC Packaging: Conversion between Tray, Tube, and Tape

4. IC Manufacturers: SanDisk, Toshiba, Micron, Samsung, AMD, SST, Intel, AMIC, Winbond, Atmel, Holtek, Fujitsu...