Xiangtan Xiangke DRL-V Heat Flow Method Multi-functional Thermal Conductivity Tester, Interface Thermal Resistance Tester
I. Overview
Thermal Conductivity Meters primarily test the thermal resistance of thin thermal conductors, thermal conductive silicone sheets, thermal conductive resins, beryllium oxide ceramics, alumina ceramics, and other small materials, as well as contact thermal resistance at solid interfaces and the thermal conductivity of the materials. The materials tested are generally in solid, sheet form, and can also be tested in powdered or paste form when enclosed in a frame.
Instrument Reference Standards: MIL-I-49456A (Insulating Sheets, Thermal Conductive Resins, Thermally Conductive Glass Fiber Reinforced); GB 5598-2015 (Method for Determining Thermal Conductivity of Beryllium Oxide Ceramics - Rod Axis Method); ASTM D5470-12 (Standard Test Method for Thermal Conductivity of Thin Thermal Conductive Solid Electrical Insulating Materials); GB/T 38712-2020 (Experimental Method for Thermal Conductivity of Ultra-thin Glass - Heat Flux Method); GB/T 29313-2012 (Test Method for Thermal Conductivity of Electrical Insulating Materials) etc.
The instrument features automatic pressure, automatic thickness measurement, and full computerized automatic measurement control functions.
The DRL-V model instrument is developed based on the DRL-III model, featuring the following characteristics:
Protective thermal devices have been added around the test rod inside the testing head (these devices provide thermal protection for the samples), expanding the temperature range of the instrument's testing capabilities and reducing the impact of ambient temperature on the test.
Increased thermal couple stack on the test rod within the test head for added thermal flow testing, enhancing resolution, accuracy, and repeatability of thermal flow testing.
Removed ice-water mixture for thermocouple cold junction compensation, simplified operation, and made it more user-friendly.
Added experimental methods such as "Aging Reliability Testing," "High Thermal Conductivity Material Testing," and "Contact Thermal Resistance Between Specimens Testing."
The DRL-3 and DRL-5 instruments are widely used for material thermal analysis testing in universities, research institutions, quality inspection departments, and manufacturing plants.
Xiangtan Xiangke DRL-V Heat Flow Method Multi-functional Thermal Conductivity Tester, main technical parameters
Technical Specifications | Instrument Model: DRL-V |
1. Temperature Range | 1. 20-80°C (High Temp: Room Temp - 100.00°C; Low Temp: 0-80.00°C (Water Bath)) 2. 20-140°C (Hot extreme: Room temperature-200.00°C; Cold extreme: 0-80.00°C [water bath]) 3. 20-190°C (Hot extreme: room temperature to 300.00°C; Cold extreme: 0-80.00°C [constant temperature bath]) 4. 100-260°C (Hot extreme: 120.00-300.00°C; Cold extreme: 80.00-240.00°C (Temperature control)) -20 to 80℃ (Hot extreme: room temperature to 100.00℃; Cold extreme: -40.00 to 60.00℃ in a water bath) 6. Operating temperature range: 40-260℃ (Hot extreme: room temperature to 500.0℃; Cold extreme: 0-80.00℃ (恒温水浴槽)) Description: The temperature range refers to the average temperature of the test sample (hot and cold surface temperatures), with the hot surface temperature slightly lower than the hot spot temperature and the cold surface temperature slightly higher than the cold spot temperature. Select one parameter for the selection. |
2. Thermal Conductivity | 1. Standard Mode: 0.1～45 W/m*k 2. High Conductivity Mode: 5-500 W/m*K (with High Conductivity Test Module) |
3. Thermal Resistance Range | 0.05～500 （cm2*k/w） |
4. Test Accuracy | Thermal Resistance Test: 10～500 cm²·K/W, error ≤ 3%; 0.05～10 cm²·K/W, error ≤ 5% 2. Thermal Conductivity Test: 0.1～5 W/m*k, Error ≤3%; 5～500 W/m*k, Error ≤5% 3. Contact Thermal Resistance Test: Error ≤ 5% 4. Aluminum Substrate (Composite Material) Thermal Resistance Test: Error ≤ 5% ± 0.1 |
5. Test Head Dimensions | 1. Φ30mm (sample size as an example for this test head); 2. Φ50mm (optional) |
6. Sample Size | 1. 0.1 to 5 W/m*K or 10 to 500 cm²*K/W, Φ30 x (0.2 to 5) mm, thickness available for stacking 2, 5-45 W/m*K or 2-10 cm²*K/W, (Φ20-Φ30) × (0.2-15) mm 3, 5~500 W/m*k, (Φ10~Φ30) x (15~30) mm (high-conductivity mode) 4. Aluminum Substrate: 15×15 (mm) Description: This sample size is the basic dimension. For detailed sample dimensions, refer to the following instructions. |
7. Pressure Measurement | 0～1000.0N |
8. Displacement Measurement | 0～40.00mm |
9. Pressure Control | Electric |
10. Experimental Method | 1. Test the thermal resistance under different pressure conditions for the sample. 2. Thermal Conductivity Test of Materials 3. Contact thermal resistance test under different medium pressures 4. Thermal Resistance Test for Aluminum Substrate (Composite Panel) 5. Aging Reliability Test 6. High thermal conductivity material thermal conductivity test (with high thermal conductivity test module) 7. Contact Heat Resistance Test Under Different Pressure Conditions (with Contact Heat Resistance Test Module) 8. Material Compression Performance Test (New Feature) |
11. Motherboard Power Supply | Voltage: 220V, 50Hz, power less than 1KW. |
Instrumentation Configuration: 1 DRL-V Thermal Conductivity Tester; 1 set of Test Software (including communication interface); 1 set of Constant Temperature Bath (either water or oil bath, configured according to the selected temperature specification) and its controller; 1 desktop computer (optional for the buyer to provide).
