PA-1030 is our high-performance conductive filling material with excellent antioxidant properties. It is widely used in the conductive and electromagnetic shielding applications of electronic, electrical, and communication products such as computers, mobile phones, electronic medical equipment, and electronic instruments.
Product Attributes:
Silver Content: 30%
Ag/cu≥(%):99.8
Fe:0.02
pb:0.03
As:0.005
sb:0.01
0:0.13
Bi:0.002
Ni:0.003
Average Particle Size: 15~18μm / Particle size distribution can be customized according to customer requirements
Loose Bulk Density: 0.5~0.7
Bulk Density: 0.9~1.3
Resistance (20μM): ≤0.005
Specific Surface Area: 0.3 m²/g ~ 0.5 m²/g

PA1030 Silver-Copper Conductive Powder


































